Bare board, Package, Populated Board Testing
Hioki combines advanced measurement technologies and proprietary high-precision probing technologies to facilitate testing and analysis of fine-pitch packaging substrates, multilayer flexible printed wiring boards, high density interconnects (HDIs), device embedded substrates, probe cards, and printed circuit boards (PCBs).
We rely on HVAC equipment to maintain acceptable temperature, humidity and ventilation levels for occupant health and comfort, and, now more than ever, to help regulate building health and manage increasing energy costs.